Nanotechnology research at Northeastern encompasses nanomanufacturing, nanomaterials, nanomedicince and bio-nanotechnology, and the societal impacts and ethics of nanotechnology.Northeastern University is establishing itself as a pioneer in the field of nanotechnology, building on its interdisciplinary strengths in Science and Engineering. http://www.nanotech.neu.edu/
Areas of interest include:
The College of Engineering
Cooperative education is integrated into all of our Bachelor of Science degree programs:
Civil & Environmental Engineering
The NSF Center for High-rate Nanomanufacturing (See Related Content)
The Center for High-rate Nanomanufacturing is focused on developing tools and processes that will enable high-rate/high-volume bottom-up, precise, parallel assembly of nanoelements (such as carbon nanotubes, nanoparticles, etc.) and polymer nanostructures.
Electronic Materials Research Institute (eMRI) (See Related Content)
The Electronic Materials Research Institute at Northeastern University was founded in September, 2002, with a mission to synergize and catalyze inter-disciplinary research and educational activities in nanomaterials.
The Nanotechnology and Society Research Group (NSRG) (See Related Content)
The Nanotechnology and Society Research Group (NSRG) is dedicated to the study of the societal dimensions of nanotechnology research, development, application, and commercialization. Our lead project, a four-year National Science Foundation supported Nanotechnology Interdisciplinary Research Team (NIRT), engages research faculty at a number of universities in a broad assessment of local, state, and federal government regulatory capacity to respond to the possible challenges posed by emerging nanotechnologies.
The Center for Nano and Microcontamination Control (See Related Content)
The Center for Nano and Microcontamination Control site at Northeastern University began in August 2002. The Center addresses particulate and chemical contamination and defects that directly affect semiconductor fabrication, where aggressive miniaturization will reduce feature sizes to less than 35 nm in the next 5-10 years. It also affects MEMS and NEMS devices with micro and nanoscale channels, and hard disk head fabrication, which is rapidly approaching semiconductor VLSI feature size.