The Center for Nano and Microcontamination Control - Northeastern University

The Center for Nano and Microcontamination Control - Northeastern University
Type Disciplines
Research Institution Engineering Fabrication Modeling Nanomanufacturing
Address Postal Code
360 Huntington Avenue 02115
City State / Province
Boston Massachusetts
E-mail Country
Web Phone
link 617.373.6012

The Center addresses particulate and chemical contamination and defects that directly affect semiconductor fabrication, where aggressive miniaturization will reduce feature sizes to less than 35 nm in the next 5-10 years. It also affects MEMS and NEMS devices with micro and nanoscale channels, and hard disk head fabrication, which is rapidly approaching semiconductor VLSI feature size.

The Center's goal is to develop state of the art techniques for micro and nanoscale contaminant control, mitigation, removal and characterization in manufacturing and fabrication processes. The Center has already developed two metrology techniques for nanoparticles, and techniques for removing nanoparticles from surfaces and nanoscale trenches.

The Center research provides understanding of contaminant transport on the micro and nano scale and explore the limitations and promise of contaminant control in nanoscale structures. The Center also offers educational programs to industry in terms of tutorials and workshops that are well attended by companies in the area of contamination control.


Our Research is focused on the fundamentals of surface cleaning and preparation:
* Understanding of physical and chemical cleaning mechanisms using megasonics, brush and other techniques, including damage evaluation and mitigation
* CMP and Post-CMP applications
* Cleaning of EUV reticles
* Measurement of particle adhesion force
* Removal of nanoparticles
* Laser Shock Cleaning
* High Concentration Ozone cleaning
* Super Critical CO2 Cleaning
* Particle generation, transport and deposition:
* Particulate contamination in low pressure processes (LPCVD, Sputtering, ion implant, etc.)
* Contamination during wafer handling

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