Paradiso Coskina

Position Department / Business Unit
Micro-Nano Integration
Institution Disciplines
VDI/VDE Innovation + Technik GmbH Electronics
City State / Provence
10623 Berlin
Country Website
+49 (0) 30 310078-222

Paradiso Coskina, expert in microsystems technology and the microelectronics supply chain, joined the VDI/VDE-IT in June 2005, where she works in the field of micro- and nanotechnologies and is responsible for the topic micro-nano-integration (MNI).

At present, she is gaining extended experience in management and administration within the FP6 IST Integrated Project NanoHand. Additionally, she is strongly involved in the management of the German MST funding program.

From 1999 to 2001 she worked as a scientific officer at the Fraunhofer IZM in the area of advanced packaging. There, she collaborated in different European projects, for example AMFAS (Application of Low Temperature Cofired Multilayer Ceramic Technology and Flip-chip Assembly Technology for Switching Converters), CUMULUS (Circuits Ultimate Miniaturisation Utilising Multi-layer Build-up Substrates) and FLIPACK (Fine Line Interconnection Packaging). In some of these projects she gained management experiences. As production manager at Infineon AG from 2001 to 2005 she was responsible for the fabrication of fiber optic products. Chairing the special symposium on Micro-Nano-Integration.

About VDI/VDE (Germany)
For 25 years, VDI/VDE Innovation + Technik GmbH (VDI/VDE-IT) has been a reliable partner of industry and research and of the political community in Research Funding, Technology Policy and Innovation Management. To assist with introduction of of new technologies.

Microsystems engineering, nano and bionano and offers a multidisciplinary team of over 120 experts in the natural and social sciences, engineers, and economists are continuously developing new ideas and methods, tailor-made to the personal needs of our customers.

Important Articles

Converging Technologies-Potentiale für Deutschland; Mikrosystemtechnik Kongress  (2005)

Joachim Kloeser, Paradiso Coskinab, Rolf Aschenbrennerb and Herbert Reichlb; "Bump formation for flip chip and CSP by solder paste printing"  Microelectronics Reliability Volume 42, Issue 3, March 2002, Pages 391-398

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