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Donglu Shi Ph.D.

Donglu Shi’s main interests include nanomaterials, superconducting materials, and biomaterials. The most recent work on nanomaterials pioneers a novel approach in the deposition of an ultrathin polymer film (2 nm thick) on nanoparticles and nanotubes via plasma polymerization. The surface-coated carbon nanotubes have shown unique properties in composite polymers and ceramics. His current research also deals with deposition of luminescent materials on nanotubes for cancer diagnosis and treatment.

Education

Ph.D. Materials Science University of Massacheusetts, Amherst 1986

Career Highlights

Donglu Shi received his M. S. and Ph. D. from the University of Massachusetts, Amherst, in 1986. After graduation, he took a Staff Scientist position at the Materials Science Division of Argonne National Laboratory in 1987 (first year as a posdoc). At Argonne, he was a principle investigator for a major Department of Energy program in electronic ceramics. In the fall of 1995, Donglu Shi joined the faculty as an Associate Professor in the Department of Materials Science and Engineering at University of Cincinnati. He was promoted to the full professor position in 2001 at University of Cincinnati.
Donglu Shi has so far published 170 refereed journal publications including Physical Review Letters, Nature, and Advanced Materials. These papers have been cited for more than 2500 times. He has edited six books in superconductivity, functional thin films, nanomaterials, biomaterials, and tissue engineering (Pergamon Press, Springer-Verlag, and Tsinghua University Press). He has also edited six special issues of Applied Superconductivity and MRS Bulletin. He holds seven US patents in electronic materials. He is currently serving on the editorial board of J. of Nanomaterials, Tsinghua Science and Technology, and 21 Century Science and Technology Frontier Book Series (Springer-Verlag and Tsinghua University Press). He has won the SIGMA XI Research Recognition Award, Honor Roll Professor Award, and Neil Wandmecher Teaching Award.

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