Microjoining and Nanojoining

 Microjoining and Nanojoining
Publication Type List Price
Book $339.95 / £179
Publication Date Imprint
04/11/08 CRC
Disciplines ISBN
Nanomanufacturing 9781420070835
Number of Pages Buy with discount
500 buy
   
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Description

Many recent advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.

Part 1 reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part 2 covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part 3 discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.

This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It will be a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering.

Features

Table of Contents

Basics of Microjoining


Mechanisms of Solid-State Bonding, J.E. Gould
Mechanisms of Soldering and Brazing, T. Takemoto
Mechanisms of Fusion Microwelding, G.A. Knorovsky and VV. Semak
Modelling of Solid-State Bonding, Y. Takahashi
Modelling of Fusion Microwelding, B. Chang
Sensing, Monitoring and Control, M. Mayer
Assembly Process Automation and Materials Handling, Y.M. Cheung and D. Liu
Microjoining and Nanojoining Processes
Microelectronics Wire Bonding, I. Lum, M. Mayer and Y. Zhou
Solid-State Diffusion Bonding, A. Shirzadi
Bonding Using Nanoparticles, A. Hirose and K.F. Kobayashi
Diffusion Soldering and Brazing, M.L. Kuntz and Y. Zhou
Laser Soldering, Y. Tian
Fluxless Soldering, J.P. Jung and S.M. Hong
Laser Microwelding, I. Miyamoto and G A Knorovsky
Electron Beam Microwelding, G.A. Knorovsky, T. Dorfmüller, U. Dilthey, and K. Woeste
Resistance Microwelding, S. Fukumoto, Y Zhou, and W Tan
Adhesive Bonding, I.S. Böhm, E. Stammen, G. Hemken, and M. Wagner
Introduction to Nanojoining, S. Sahin, M. Yavuz, and Y.N. Zhou
Microjoining of Materials and Applications of Microjoining
Joining of High Temperature Superconductors, G. Zou
Joining of Shape Memory Alloys, K. Uenishi and K.F. Kobayashi
Wafer Bonding, J. Wei and Z. Sun
Plastics Microwelding, I. Jones
Microjoining in Medical Components and Devices, K.J. Ely and Y.N. Zhou
Hermetic Sealing of Solid Oxide Fuel Cells, M. Brochu and R.E. Loehman
Joining of Bulk Nanostructured Materials, M. Brochu
Ceramic/Metal Bonding, A. Wu

Contributors

by siebo last modified September 21, 2009 - 08:10
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Features

  • Reviews the basics of nanojoining including solid-state bonding and fusion microwelding
  • Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modeling
  • Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
  • A valuable reference for production engineers, designers and researchers