Microjoining and Nanojoining
DescriptionMany recent advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part 1 reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part 2 covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part 3 discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It will be a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Features Table of ContentsBasics of MicrojoiningMechanisms of Solid-State Bonding, J.E. Gould Mechanisms of Soldering and Brazing, T. Takemoto Mechanisms of Fusion Microwelding, G.A. Knorovsky and VV. Semak Modelling of Solid-State Bonding, Y. Takahashi Modelling of Fusion Microwelding, B. Chang Sensing, Monitoring and Control, M. Mayer Assembly Process Automation and Materials Handling, Y.M. Cheung and D. Liu Microjoining and Nanojoining Processes Microelectronics Wire Bonding, I. Lum, M. Mayer and Y. Zhou Solid-State Diffusion Bonding, A. Shirzadi Bonding Using Nanoparticles, A. Hirose and K.F. Kobayashi Diffusion Soldering and Brazing, M.L. Kuntz and Y. Zhou Laser Soldering, Y. Tian Fluxless Soldering, J.P. Jung and S.M. Hong Laser Microwelding, I. Miyamoto and G A Knorovsky Electron Beam Microwelding, G.A. Knorovsky, T. Dorfmüller, U. Dilthey, and K. Woeste Resistance Microwelding, S. Fukumoto, Y Zhou, and W Tan Adhesive Bonding, I.S. Böhm, E. Stammen, G. Hemken, and M. Wagner Introduction to Nanojoining, S. Sahin, M. Yavuz, and Y.N. Zhou Microjoining of Materials and Applications of Microjoining Joining of High Temperature Superconductors, G. Zou Joining of Shape Memory Alloys, K. Uenishi and K.F. Kobayashi Wafer Bonding, J. Wei and Z. Sun Plastics Microwelding, I. Jones Microjoining in Medical Components and Devices, K.J. Ely and Y.N. Zhou Hermetic Sealing of Solid Oxide Fuel Cells, M. Brochu and R.E. Loehman Joining of Bulk Nanostructured Materials, M. Brochu Ceramic/Metal Bonding, A. Wu Contributors |
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CRC Press — 2010 NanoScience and CleanTech catalog
