The MEMS Handbook, Second Edition - 3 Volume Set

Mohamed Gad-el-Hak Virginia Commonwealth University
The MEMS Handbook, Second Edition - 3 Volume Set
Publication Type List Price
Reference $209.95 / £134
Publication Date Imprint
12/22/2005 CRC
Disciplines ISBN
MEMS/NEMS 9780849321061
Number of Pages Buy with discount
1720 buy
   
view list

Description

The new edition of the bestselling MEMS Handbook is now presented as a three-volume set that offers state-of-the-art coverage of microelectromechanical systems, their fundamentals (volume one), design and fabrication (volume 2), and applications (volume 3). Written by a team of authors unsurpassed in their experience and standing in the scientific community, this edition includes new chapters on computational methods, polymeric-based micro- and nanosensors and actuators, molecular self-assembly, and the hydrodynamics of small-scale internal gaseous flows. While each volume is available individually, purchased as a set, they come packaged-at a significant cost reduction-in a handsome slip-case.

Table of Contents

Volume 1, MEMS: Introduction and Fundamentals. Volume 2, MEMS: Design and Fabrication. Volume 3, MEMS: Applications.

Contributors

Contributor Borboni, Alberto, Universita degli Studi di Brescia, Italy Contributor Agarwal, Ramesh K., Washington University, St. Louis, Missouri, USA Contributor Atkinson, Gary M., Virginia Commonwealth University, Richmond, USA Contributor Beheim, Glenn M., NASA Glenn Research Center, Cleveland, Ohio, USA Contributor Bernstein, Gary H., University of Notre Dame, Indiana, USA Contributor Berstrom, Paul L., Michigan Technical University, Houghton, USA Contributor Beskok, Ali, Texas A&M University, College Station, Texas, USA Contributor Bewley, Thomas R., University of California at San Diego, La Jolla, USA Contributor Breuer, Kenneth S., Brown University, Providence, Rhode Island, USA Contributor Chang, Hsueh-Chia, University of Notre Dame, Indiana, USA Contributor Chen, Liang-Yu, Nasa Glenn Research Center, Cleveland, Ohio, USA Contributor Choi, Haecheon, Seoul National University, Korea Contributor Christenson, Todd, HT MicroAnalytical Inc., Albuquerque, New Mexico, USA Contributor Cohen, Adam L., Microfabrica Inc., Van Nuys, California, USA Contributor Ebefors, Thorbjorn, SILEX Microsystems AB, Jarfalla, Sweden Contributor Gianchandani, Yogesh, University of Michigan, Ann Arbor, USA Contributor Goodwine, J. William, University of Notre Dame, Indiana, USA Contributor Hadjiconstantinou, Nicolas, Massachusettes Institute of Technology, Cambridge, USA Contributor Hunter, Gary W., NASA Glenn Research Center, Cleveland, Ohio, USA Contributor Jia, Guangyao, University of California-Irvine, USA Contributor Kirby, Robert M., University of Utah, Salt Lake City, USA Contributor Lee, Sang-Youp, Purdue University, West Lafayette, Indiana, USA Contributor Lofdahl, Lennart, Chalmers University of Technology, Goteborg, Sweden Contributor Miwa, Jill Atsuko, University of Quebec, Varennes, Canada Contributor Naguib, Ahmed, Michigan State University, East Lansing, USA Contributor Okojie, Robert S., NASA Glenn Research Center, Cleveland, Ohio, USA Contributor Oliver, Andrew D., Sandia National Laboratories, Albuquerque, New Mexico, USA Contributor Oron, Alexander, Technion, Israel Institute of Technology, Haifa Contributor Peterson, G. P. "Bud", University of Colorado, Boulder CO USA Contributor Sen, Mihir, University of Notre Dame, Indiana, USA Contributor Sharp, Kendra V., Penn State University, University Park, Pennsylvania, USA Contributor Sharpe, Jr, William N., The Johns Hopkins University, Baltimore, Maryland, USA Contributor Trimmer, William, Belle Mead Research, Inc., Hillsborough, New Jersey, USA Contributor Tseng, Fan-Gang, National Tsing-Hua University, Hsinchu, Taiwan Contributor Zorman, Christian A., Case Western Reserve University, Cleveland, Ohio, USA Contributor Adrian, Ronald J., Arizona State University, Tempe, USA Contributor Bang, Christopher A., Micrfabrica Inc., Van Nuys, California, USA Contributor Ben, Yuxing, University of Notre Dame, Indiana, USA Contributor Evans, Laura J., NASA Glenn Research Center, Cleveland, Ohio, USA Contributor Goodson, Holly V., University of Notre Dame, Indiana, USA Contributor Jang, Jaesung, Purdue University, West Lafayette, Indiana, USA Contributor Karniadakis, George Em, Brown University, Providence, Rhode Island, USA Contributor Kruglick, Ezekiel J. J., Microfabrica Inc., Burbank, California, USA Contributor Lei, Jih-Fen, NASA Glenn Research Center, Cleveland, Ohio, USA Contributor Li, Gary G., Freescale Semiconductor Incorporated, Tempe, Arizona, USA Contributor Liu, Chung-Chiun, Case Western Reserve University, Cleveland, Ohio, USA Contributor Madou, Marc J., University of California, Irvine, USA Contributor Makel, Darby B., Makel Engineering, Inc., Chico, California, USA Contributor Mayaram, Kartikeya, Oregon State University, Corvallis, USA Contributor McMahon, J. Jay, Rensselaer Polytechnic Institute, Troy, New York, USA Contributor Mehregany, Mehran, Case Western Reserve University, Cleveland, Ohio, USA Contributor Mikulchenko, Oleg, Intel Corporation, Sacramento, California, USA Contributor Molho, Joshua I., Caliper Life Sciences Incorporated, Mt. View, California, US Contributor Muntz, E. Phillip, University of Southern California, Los Angeles, USA Contributor Ounaies, Zoubeida, Texas A&M University, College Station, USA Contributor Park, Jae-Sung, Shriners Institute, Boston, Massachusetts, USA Contributor Plummer, David W., Sandia National Laboratories, Albuquerque, New Mexico, USA Contributor Rosei, Federico, University of Quebec, Varennes, Canada Contributor Santiago, Juan G., Stanford University, California, USA Contributor Sobhan, Choondal B., National Institute of Technology, Calicut, India Contributor Snider, Gregory L., Notre Dame University, Indiana, USA Contributor Stemme, Goran, Royal Institute of Techology, Stockholm, Sweden Contributor Stroud, Robert H., The Aerospace Corporation, Chantilly, Virginia, USA Contributor Trombley, Melissa L., Michigan Technological Universty, Houghton, USA Contributor Vargo, Stephen E., SiWave Incorporated, Arcadia, California, USA Contributor Wereley, Steven T., Purdue University, West Lafayette, Indiana, USA Contributor Wilson, Chester G., Louisiana Tech University, Ruston, Louisiana, USA Contributor Xu, Jennifer C., NASA Glenn Research Center, Cleveland, Ohio, USA Contributor Young, Marcus, University of Southern California, Los Angeles, USA Contributor Yun, Keon-Young, Samhonsa Company, Seoul, South Korea Contributor Zohar, Yitshak, The University of Arizona, Tucson, USA Editor 1 Gad-el-Hak, Mohamed, Virginia Commonwealth University, Richmond, USA
by siebo last modified September 17, 2009 - 12:59
Document Actions

Features

  • - Provides complete coverage of the broad, interdisciplinary, and quickly growing fields of MEMS and nanotechnology
  • - Comprises chapters from leading experts from around the world
  • - Updates existing chapters where necessary and includes seven completely new chapters
  • - Includes numerous case studies, examples, figures, and illustrations