Handbook of Photomask Manufacturing Technology

Syed Rizvi Nanotechnology Education and Consulting Services
Handbook of Photomask Manufacturing Technology
Publication Type List Price
Reference $175.95 / £111
Publication Date Imprint
4/7/2005 CRC
Disciplines ISBN
Electronics 9780824753740
Number of Pages Buy with discount
728 buy
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Description

As the semiconductor industry attempts to increase the number of functions that will fit into the smallest space on a chip, it becomes increasingly important for new technologies to keep apace with these demands. Photomask technology is one of the key areas to achieving this goal. Although brief overviews of photomask technology exist in the literature, the Handbook of Photomask Manufacturing Technology is the first in-depth, comprehensive treatment of existing and emerging photomask technologies available.

The Handbook of Photomask Manufacturing Technology features contributions from 40 internationally prominent authors from industry, academia, government, national labs, and consortia. These authors discuss conventional masks and their supporting technologies, as well as next-generation, non-optical technologies such as extreme ultraviolet, electron projection, ion projection, and x-ray lithography. The book begins with an overview of the history of photomask development. It then demonstrates the steps involved in designing, producing, testing, inspecting, and repairing photomasks, following the sequences observed in actual production. The text also includes sections on materials used as well as modeling and simulation.

Continued refinements in the photomask-making process have ushered in the sub-wavelength era in nanolithography. This invaluable handbook synthesizes these refinements and provides the tools and possibilities necessary to reach the next generation of microfabrication technologies.

Table of Contents

Introduction. Introduction to Mask Making. Mask Writing. Data Preparation. Mask Writers: An Overview. E-Beam Mask Writers. Laser Mask Writers. Optical Masks. Optical masks: An Overview. Conventional Optical Masks. Advanced Optical Masks. NGL Masks. NGL Masks: An Overview. Masks for Electron Beam Projection Lithography. Masks for Extreme Ultraviolet Lithography. Masks for Ion Projection Lithography. Mask for Proximity X-Ray Lithography. Mask Processing, Materials, and Pellicles. Mask Substrate. Resists for Mask Making. Resist Charging and Heating. Mask Processing. Mask Materials: Optical Properties. Pellicles. Mask Metrology, Inspection, Evaluation, and Repairs. Photomask Feature Metrology. Optical Critical Dimension Metrology. Photomask Critical Dimension Metrology in the Scanning Electron Microscope. Geometrical Characterization of Mask Using SPM. Metrology of Image Placement. Optical Thin Film Metrology for Photomask Applications. Phase Measurement Tool for PSM. Mask Inspection: Theories and Principle. Tool for Inspecting Masks: Lasertec MD 2500. Tool for Mask Image Evaluation. Mask Repairs. Modeling and Simulation. Modeling and Simulation. Index.

Contributors

Contributor Medeiros, David R., IBM T.J. Watson Research, Yorktown Heights, New York, USA Contributor Bai, Min, Stanford University, California, USA Contributor Postek, Michael T., NIST, Gaithersburg, Maryland, USA Contributor Babin, Sergey, Abeam Technologies, California, USA Contributor Erdmann, Andreas, Fraunhofer Institut IISB, Attain, Germany Contributor Hoobler, Ray J., NANOmetrics, Inc., Milpitas, California, USA Contributor Kalus, Christian, SIGMA-C, Munchen, Germany Contributor Kimmel, Kurt R., IBM Microelectronics Division, Albany, New York, USA Contributor Kusunose, Hal, Lasertec Corporation, Yokohama, Japan Contributor Lee, Randall, FEI Company, Peabody, Massachusetts, USA Contributor Liberman, Vladimir, Massachusetts Institute of Technology, Lexington, USA Contributor Maurer, Wilhelm, Infineon Technologies AG, Munich, Germany Contributor Muckenhirn, S., AtometX, Montgeron, France Contributor Potzick, James, US NIST, Gaithersburg, Maryland, USA Contributor Oda, Masatoshi, NTT Telecommunications Energy Laboratories, Kanagawa, Japan Contributor Rydberg, Christer, Micronic Laser Systems AB, Taby, Sweden Contributor Rosenbusch, Anja, Applied Materials, Santa Clara, California, USA Contributor Saitou, Norio, Hitachi High-Technologies, Tokyo, Japan Contributor Yan, Pei-yang, Intel Corporation, Santa Clara, California, USA Contributor Yen, Yung-Tsai, Micro Lithography, Inc., Sunnyvale, California, USA Contributor Zanzal, Andrew G., Quantiscript Inc. Contributor Zibold, Axel, Carl Zeiss SMS GmbH, Jena, Germany Contributor Yoshioka, Nobuyuki, Renesas Technology Corporation, Tokyo, Japan Contributor Matsuyama, Takayoshi, Japan Lasertec Corporation, Yokohama Contributor Apak, Ebru, Contributor Sano, Hisatake, Dai Nippon Printing Co. Ltd., Chiba-ken, Japan Contributor Yonezawa, Makato, Lasertec Corporation, Yokohama, Japan Contributor Tummala, R. Lal, San Diego State University, California, USA Contributor Lercel, Michael, SEMATECH, Austin, Texas, USA Contributor Pease, R. Fabian, Stanford University, USA Contributor Chu, Dachen, McKinsey & Company, Beijing, Peoples Republic of China Contributor Rathsack, Benjamen M., Contributor Willson, C. Grant, University of Texas, Austin, USA Contributor van Adrichem, P.J.M., Contributor Butschke, Joerg, IMS Chips Stuttgart, Germany Contributor Hemar, Shirley, Applied Materials, Rehovot, Israel Contributor Kamm, Frank-Michael, Infineon Technologies, Dresden, Germany Contributor Letzkus, Florian, Institut fur Mikroelektronik Stuttgart, Germany Contributor Loeschner, Hans, IMS Nanofabrication GmbH, Vienna, Austria Contributor Meyyappan, A., Particle Sizing Systems, Inc., Santa Barbara, California, US Contributor Schellenberg, Franklin, Mentor Graphics, San Jose, California, USA Contributor Takac, Michael T., Contributor Nishi, Yoshio, Stanford University, California, USA Contributor Palmer, Shane R., SEMATECH, Austin, Texas, USA Editor 1 Rizvi, Syed, Nanotechnology Education and Consulting Services, San Jose
by siebo last modified September 14, 2009 - 13:30
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Features

  • - Provides a multi-dimensional view of photomask technology
  • - Offers a general overview and detailed, in-depth discussions of photomask technology
  • - Builds expertise on design and processing to optimize photomask constraints without sacrificing functionality and specs of the chip
  • - Discusses mask writing, providing detailed treatment of electron beam writers and laser writers
  • - Contains a complete walkthrough of the development process from conception to final testing, including modeling and simulation