Carbon Nanotube Interconnects

Authors

Anna W. Topol IBM T. J. Watson Research Center

Publication Date

4/13/04

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Abstract

The historical drive toward higher speed and increased density in emerging generations of integrated circuitry (IC) has caused significant interest in innovative interconnect concepts that exploit the properties of carbon nanotubes (CNTs). This interest is driven by the projected aptitude of “ideal” CNTs to sustain ballistic (scatter-free) electron transport, with little energy dissipation along the tube. Accordingly, nanotubes could provide critical performance enhancements in gigascale device and interconnect architectures, as compared with traditional electrical wires, thus potentially ensuring the continuation of Moore's law well into the nanoscale regime.

In this respect, significant progress has been reported over the last few years in the development of CNT networks that display promising properties and performance in nanometer-scale devices and wiring schemes. However, the potential gains presented by CNT-based wiring schemes have been hindered by practical considerations pertaining to current CNT fabrication and integration protocols.