Atomic Force Microscopy Simulation of Interaction Forces in CMP Applications


Brij M. Moudgil Department of Materials Science and Engineering, University of Florida

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Chemical mechanical polishing (CMP), otherwise known as chemical mechanical planarization, has been an enabling catalyst for rapid technological advancements in microelectronic fabrication and design over the last decade. Although now a multibillion-dollar business in the microelectronics industry, besides patents, there is a dearth of scientific publications on the subject. After initially touching on the significance of CMP, this article reviews the literature on the versatility of atomic force microscopy (AFM) as a means to probe and simulate the CMP process at the single-particle level.