Atomic Force Microscopy Simulation of Interaction Forces in CMP Applications

Authors

Brij M. Moudgil Department of Materials Science and Engineering, University of Florida

Publication Date

12/14/04

Read full article online

Full Article

Abstract

Chemical mechanical polishing (CMP), otherwise known as chemical mechanical planarization, has been an enabling catalyst for rapid technological advancements in microelectronic fabrication and design over the last decade. Although now a multibillion-dollar business in the microelectronics industry, besides patents, there is a dearth of scientific publications on the subject. After initially touching on the significance of CMP, this article reviews the literature on the versatility of atomic force microscopy (AFM) as a means to probe and simulate the CMP process at the single-particle level.