New Ultrathin Wafer Bonding Boosts MEMS/NEMS Apps

Read original story	New Ultrathin Wafer Bonding Boosts MEMS/NEMS Apps
Description	A key industry milestone has been reached today surrounding the handling and processing of ultrathin wafers. In their ongoing joint development work, EV Group (EVG), a leading supplier of wafer-bon...
Imported on	01 Jan 2008, 20:15
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