Intel Invests in ASML to Accelerate Deployment of Extreme Ultra-violet (EUV) Lithography

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Intel Invests in ASML to Accelerate Deployment of Extreme Ultra-violet (EUV) Lithography

Description Intel commits approximately $1.0 billion to ASML's research and development programs to help accelerate deployment of new technologies for 450-millimeter (mm) wafers and extreme ultra-violet (EUV) lithography by as much as two years.
Imported on 28 Jul 2012, 10:59
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