Scientists develop revolutionary nanotechnology copper solder

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Scientists develop revolutionary nanotechnology copper solder

Description Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto have developed a revolutionary nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200 C.
Imported on 28 Oct 2012, 10:26
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